2022-194 - An Endovascular Electrode Array for Minimally Invasive Recording and Stimulation

Description:
  • Electrical recording and stimulation
  • Management of diseases such as epilepsy
  • Electrophysiological research

Abstract

USC researchers have developed a thin film electrode array that can be implanted using endovascular methods for minimally-invasive, high-resolution electrical recording and stimulation of the nervous system and other electrogenic tissue. The device utilizes micromachining and miniaturization to maximize the number of electrodes, while still being thin and flexible enough to travel through most small veins and arteries. This technology will allow for medical management of diseases such as epilepsy without the risks inherent in invasive surgery.

Benefit

  • Minimally-invasive, high-resolution electrode array
  • Micromachining allows for more electrodes than previous endovascular technology
  • Thin and flexible

Market Application

Recording and stimulating electrical signals in the brain is an essential part of treatment for conditions such as refractory epilepsy. To achieve high-resolution results, small electrodes must be placed close to the target tissue, which often requires invasive surgical procedures and can lead to tissue damage, permanent neurological damage, and even death. However, there is an opportunity to utilize the body's vasculature network for less invasive access. By employing miniature electrodes and precise catheter navigation, it is possible to access tissues of interest with minimal damage.

Publications

Thielen, Brianna, et al. "Making a case for endovascular approaches for neural recording and stimulation." Journal of neural engineering 20.1 (2023): 011001. https://doi.org/10.1088/1741-2552/acb086

Stage of Development

  • Prototype developed
  • Available for licensing

Patent Information:

  • Title: Thin Film Endovascular Electrode Array and Method of Fabrication
  • App Type: Utility
  • Country: United States
  • Serial No.: 18/401,817
  • Patent No.:  
  • File Date: 1/2/2024
  • Issued Date:  
  • Expire Date:  
  • Patent Status: Patent Pending