Description:
- Quantum computing
- Cryogenic quantum chip to classical world quantum interconnect for heterogeneous quantum devices (memory, sensors, detectors, circulators, qubit sources)
Abstract
USC inventors have designed a heterogeneously integrated quantum chip optoelectronics interposer (QuIP). QuIP enhances qubit performance, offers controlled coupling between qubit devices, decreases cross-talk between qubit devices, and improves thermal isolation, low microwave loss, and substrate mode suppression. The technology is easily manufacturable and offers a novel optical solution for on-chip, chip-to-chip, and cryogenic-to-outside world interconnect.
Benefits
- Improves scalability, coherency, and integrability
- High volume manufacturable
- Minimizes electromagnetic field leakage
- Suppresses cross-talk and environmental disturbances
- Smaller form factor than prior art
- Eliminates DC interference
Market Application
As quantum computing advances, demand grows for more reliable and scalable quantum computer architectures. However, heterogeneous quantum devices are difficult to integrate monolithically; furthermore, material and thermodynamic mismatch, complex control and routing, and reduced qubit coherence all pose challenges for these architectures. Scalable interposer architecture offers a promising solution, as it could merge and connect different functionalities within a sophisticated chip while maintaining qubit coherence.
Publications
Kudalippalliyalil, Ramesh, et al. "Heterogeneously integrated quantum chip interposer packaging." 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022. https://doi.org/10.1109/ECTC51906.2022.00294
Stage of Development
- Simulation tested
- Available for licensing